Título:
Investigation of Thermal Parameters Effects on the Microstructure, Microhardness and Microsegregation of Cu-Sn alloy Directionally Solidified under Transient Heat Flow Conditions
Ano:
2019
DOI:
10.1590/1980-5373-mr-2019-0259
Revista:
ISSN:
19805373
Home:
[http://https://doi.org/10.1590/1980-5373-mr-2019-0259][doi:10.1590/1980-5373-mr-2019-0259]
Idioma:
Português